TECAPEEK® CMF Plate

TECAPEEK® CMF is a ceramic filled PEEK compound developed specifically for micro-machinability, and it is white rather than the usual beige or black. The ceramic loading raises tensile strength to 15,200 psi and modulus of elasticity to roughly 800,000 psi while holding compressive strength at 6,700 psi at 2 percent strain and Shore D hardness at 90. It keeps PEEK's thermal performance with a 500°F continuous service temperature and a 642°F melting point, and it is a strong dielectric at 57 kV/mm with volume resistivity of 10¹⁴ ohm-cm. Charpy impact strength is 65 kJ/m².

The target application is semiconductor test hardware: IC test sockets, probe card components, burn-in fixtures and electronic test tooling, plus precision mechanical and vacuum chamber parts. What sets it apart on the machine is behavior at the tool. It resists burr formation on fine features and supports drilled micro-holes below 0.1 mm with high hole-position accuracy, which is why it displaces unfilled PEEK on dense socket patterns. It is RoHS compliant. Expect the ceramic filler to be abrasive, so plan on carbide or diamond tooling and shorter insert life, and avoid sharp internal corners because it is less ductile than unfilled PEEK.